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NOTEBOOK - System BIOS Update F.28 for 8760w


Document ID: c03482791

Version: 1

NOTEBOOK - System BIOS Update F.28 for 8760w

Release Date: 2012-09-07

Last Updated: 2012-09-19


  • Added support for dual USB keyboards in the MS DOS environment.
  • Added location, manufacturer, size, and speed for each memory slot in the F10 BIOS Setup (Computer Setup).
  • Updated the MEBX version to
  • Updated the PXE code version to
  • Added support for Wake On LAN (WOL) with DC power.
  • Fixed an issue where the BIOS cannot be flashed unattended if the BIOS password is larger than 16 characters. (This issue only occurred when the BIOS is flashed in delay mode.)
  • Added Max SATA Speed option in F10 BIOS Setup (Computer Setup). This will allow the user to set the maximum SATA speed to 6.0 Gbps or to 3.0 Gbps.
  • Fixed an issue where the BIOS Power On feature would not wake up the computer from the Off state in certain scenarios.
  • Fixed an intermittent issue where the optical drive tray would not open when the eject button was pressed.
  • Fixed an intermittent issue where the battery may not start to charge if it had been fully discharged.
  • Fixed an intermittent issue where some computers would not boot from Solid State Drives (SSDs).


F10 BIOS Setup (Computer Setup) quarterly refresh maintenance release.


  • By default, the new F10 BIOS Setup (Computer Setup) option, "Max SATA Speed," will be set to 6.0 Gbps.
  • The new F10 BIOS Setup (Computer Setup) option, "Wake on LAN on DC mode," will allow the computer to be able to wake up from Off, Sleep, or Hibernation while running on battery. By default, this option will be disabled.
  • The new PXE code version provides security enhancements that could require configuration changes on the PXE server.


Effective Date: 2012-09-20

Hardware Platforms Affected: HP EliteBook 8760w Mobile Workstation
Components Affected: HP EliteBook 8760w Mobile Workstation
©Copyright 2012 Hewlett-Packard Development Company, L.P.
Hewlett-Packard Company shall not be liable for technical or editorial errors or omissions contained herein. The information provided is provided "as is" without warranty of any kind. To the extent permitted by law, neither HP or its affiliates, subcontractors or suppliers will be liable for incidental,special or consequential damages including downtime cost; lost profits;damages relating to the procurement of substitute products or services; or damages for loss of data, or software restoration. The information in this document is subject to change without notice. Hewlett-Packard Company and the names of Hewlett-Packard products referenced herein are trademarks of Hewlett-Packard Company in the United States and other countries. Other product and company names mentioned herein may be trademarks of their respective owners.

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